ONSEMI (ON) Unveils Embedded Power Platform With Subaru as Early Partner
onsemi's new Embedded Power Platform uses the silicon wafer as the package itself, promising 3-5x higher power density, with sampling starting in 2026.
onsemi (ON) has unveiled the Embedded Power Platform (EPP), a power-architecture approach that uses the silicon wafer itself as the foundation of the package rather than housing chips in a separate package. The company says the design delivers up to 3 to 5 times higher power density than current solutions, depending on the application, and is aimed at AI data centers, electrified vehicles and industrial automation. Sampling is expected to begin in 2026 with strategic customers and ecosystem participants across automotive and AI applications.
